IC-FTAI’2024 TRACKS

• T1.1: Antenna theory.
• T1.2: Antenna feeds and matching circuits.
• T1.3: Mutual coupling in antenna arrays.
• T1.4: Dielectric resonator antennas.
• T1.5: Microstrip antennas, arrays, and circuits.
• T1.6: Slotted and guided wave antennas.
• T1.7: Phased-array antennas.
• T1.8: Reflector and reflectarray antennas.
• T1.9: Electrically small antennas.
• T1.10: Broadband/ultra-wideband antennas.
• T1.11: Multi-band antennas.
• T1.12: Adaptive, active, and smart antennas.
• T1.13: Reconfigurable antennas and arrays.
• T1.14: Antenna synthesis and measurements.
• T1.15: Biomedical applications.
• T1.16: MIMO implementations and applications.
• T1.17: Mobile and PCS antennas.
• T1.18: RFID antennas and systems.
• T1.19: Ultra-wideband systems.
• T1.20: Vehicular antennas and electromagnetics.
• T1.21: Software-defined/cognitive radio.
• T1.22: On-chip antennas.
• T1.23: Wireless power transmission and harvesting.
• T1.24: 3D printed antennas and structures.
• T1.25: Millimeter-wave, sub-mm-wave, terahertz, optical antennas.
• T1.26: Terahertz, infrared, and optical antennas.
• T1.27: Other related fields.

• T2.1: Electromagnetic theory.
• T2.2: Electromagnetic material properties and measurements.
• T2.3: Frequency-selective surfaces.
• T2.4: Electromagnetic bandgap materials.
• T2.5: Metamaterials and metasurfaces.
• T2.6: Nano-electromagnetics.
• T2.7: Electromagnetic education.
• T2.8: Propagation channel measurements, prediction and simulation.
• T2.9: Electromagnetics pulse.
• T2.10: High power electromagnetics.
• T2.11: Electromagnetics Hazard.
• T2.12: Bioengineering systems and applications.
• T2.13: Metals and their alloy materials.
• T2.14: Conductive fabric.
• T2.15: Intrinsic conductive polymer materials.
• T2.16: Carbon materials.
• T2.13: Other related fields.

• T3.1: Computational electromagnetics.
• T3.2: High-frequency and asymptotic methods.
• T3.3: Integral-equation methods.
• T3.4: FDTD methods.
• T3.5: FEM methods.
• T3.6: Hybrid method.
• T3.7: Techniques for transient simulations.
• T3.8: Optimization methods in EM designs.
• T3.9: Parallel and special-processor-based numerical methods.
• T3.10: Indoor, urban, terrestrial, and ionospheric propagation.
• T3.11: Propagation and scattering in random or complex media.
• T3.12: Scattering, diffraction, and RCS.
• T3.13: Inverse scattering and imaging.
• T3.14: Remote sensing.
• T3.15: Underwater and underground sensor and actuator networks.
• T3.16: ECM / ECCM.
• T3.17: Telemetry, defense, transportation, automated testing and scattering.
• T3.18: Small/micro/Nano satellite systems.
• T3.19: Radar environment and phenomenology.
• T3.20: Ground to air, Ground to space surveillance.
• T3.21: Weather radar.
• T3.22: Other related fields.

• T4.1: Field analysis, guided waves, and computational EM.
• T4.2: Circuit and system CAD algorithms.
• T4.3: Instrumentation and techniques for guided and over-the-air measurements.
• T4.4: Planar passive components and circuits, excl. filters.
• T4.5: Planar passive filters.
• T4.6: Integrated passive circuits and filters.
• T4.7: Non-planar passive components, filters, and other circuits.
• T4.8: Tunable passive circuits and active filters.
• T4.9: Microwave acoustic, ferrite, ferroelectric, phase-change, & MEMS components.
• T4.10: Packaging, MCMs, and 3D manufacturing technologies.
• T4.11: Semiconductor device technologies and modeling.
• T4.12: HF/VHF/UHF circuits, technologies, and applications.
• T4.13: Signal generation, modulators, frequency conversion.
• T4.14: Microwave and millimeter-wave low-noise amplifiers, variable-gain amplifiers, and receivers.
• T4.15: Low-power (<10 W) amplifiers, below 30 GHz.
• T4.16: High-power (>=10 W) RF and microwave amplifiers, below 30 GHz.
• T4.17: Millimeter-wave and THz power amplifiers.
• T4.18: Linearization and transmitter techniques for power amplifiers.
• T4.19: Mixed-signal, wireline, and signal shaping circuits.
• T4.20: Integrated transceivers and phased-array chips for beamformers and imaging.
• T4.21: Terahertz and photonic integrated circuits.
• T4.22: New Materials Technologies and Applications.
• T4.23: MEMS & Sensor Technologies.
• T4.24: Wearable, Flexible, and Stretchable Electronics.
• T4.25: Embedded Systems and VLSI.
• T4.26: Other related fields.

• T5.1: Machine learning.
• T5.2: Deep learning.
• T5.3: Natural language processing.
• T5.4: Computer vision.
• T5.5: Intelligent Network.
• T5.6: Automation.
• T5.7: Analytics.
• T5.8: Ethics of artificial intelligence.
• T5.9: Intelligence amplification.
• T5.10: Edge computing.
• T5.11: Automated machine learning.
• T5.12: Medical Science.
• T5.13: Logistics and Transportation.
• T5.14: Manufacturing and Industry.
• T5.15: Customer Service.
• T5.16: Quantum Computing.
• T5.17: Neuromorphic Architecture.
• T5.18: In-Memory Computing.
• T5.19: Photonic Computing.
• T5.20: Reconfigurable Architecture.
• T5.21: Cloud-based computing.
• T5.22: Edge computing.
• T5.23: Advanced memory technologies.
• T5.24: Other related fields.

• T6.1: Data Warehousing.
• T6.2: Internet of Things (IoT).
• T6.3: Big data.
• T6.4: Cloud computing.
• T6.5: Semantic web.
• T6.6: Data mining.
• T6.7: Computer Expert System.
• T6.8: Human-Machine Systems.
• T6.9: Next-level phishing attacks.
• T6.10: Cyber security in the board room.
• T6.11: IoT cyber-attacks.
• T6.12: Cyber resilience.
• T6.13: Zero trust.
• T6.14: Cyber warfare and state.
• T6.15: Soft skills.
• T6.16: Cyber security regulation.
• T6.17: Automation.
• T6.18: Cobot.
• T6.19: Intelligence.
• T6.20: Robot.
• T6.21: Unmanned aerial vehicle.
• T6.22: Internet robot.
• T6.23: Humanoid robot.
• T6.24: Autonomous robot.
• T6.25: Assistive robots.
• T6.26: Other related fields.

• T7.1: Genomics.
• T7.2: Drug development.
• T7.3: Proteomics.
• T7.4: Biological modeling.
• T7.5: Metabolomics.
• T7.6: Bioinformatics.
• T7.7: Transcriptomics.
• T7.8: Big data.
• T7.9: AI and machine learning.
• T7.10: Biodiversity.
• T7.11: Personalized health.
• T7.12: Neural networks.
• T7.13: RNA-seq analysis.
• T7.14: Mathematical modeling.
• T7.15: Mirna function identification.
• T7.16: Evolutionary studies.
• T7.17: Metabolomics.
• T7.18: Other related fields.

• T8.1: Wireless power transmission.
• T8.2: Sensing and RFID systems.
• T8.3: Microwave and millimeter-wave wireless subsystems and systems.
• T8.4: Radar and imaging systems.
• T8.5: Airborne and space systems.
• T8.6: MHz-to-THz devices, circuits, and systems for biological and healthcare applications.
• T8.7: AI/ML for RF to mmWave.
• T8.8: Quantum devices, circuits, and systems.
• T8.9: Model-based system engineering.
• T8.10: SubTHz and THz Systems.
• T8.11: Other innovative MHz-to-THz systems and applications.
• T8.12: Advance Robotics Systems.
• T8.13: Mechatronics Engineering Applications.
• T8.14: Reconfigurable Computing.
• T8.15: Radar technology and applications.
• T8.16: Mobility, localization and management Aspects.
• T8.17: Embedded systems.
• T8.18: Mobile computing.
• T8.19: Networks and systems.
• T8.20: Reconfigurable computing sensor networks.
• T8.21: Signal processing for AI applications.
• T8.22: Computational thinking and education analysis.
• T8.23: Data communication and networking.
• T8.24: Neural net and support vector machine.
• T8.25: Hybrid and nonlinear system.
• T8.26: Fuzzy set theory, fuzzy control, and system.
• T8.27: Visual information processing.
• T8.28: Other related fields.

• T9.1: Space-time coding and MIMO systems.
• T9.2: Modulation, multimedia, coding and diversity.
• T9.3: B3G/4G systems, WiMAX, WLAN and WPAN.
• T9.4: Optical/satellite and space communications.
• T9.5: Signal processing for wireless communications.
• T9.6: RFID/emerging wireless/mobile applications.
• T9.7: Cognitive radio and software defined radio.
• T9.8: Communications, imaging and networking.
• T9.9: Audio, acoustic and remote sensing.
• T9.10: Mm-wave technologies for 5G / 6G.
• T9.11: Wireless and cyber security.
• T9.12: Telecommunication networks and sensor array.
• T9.13: IoT, big data, edge and cloud computing.
• T9.14: Smart Grid and Green Communications.
• T9.15: Space communication and on-board hardware design.
• T9.16: Communication Software, machine learning and AI for communications.
• T9.17: Other related fields.

Track10: Power Management and Control