The Art and Science of Packaging High-Coupling Photonics Devices and Modules
22 October, 2012
Wood Hi Cheng (National Sun Yat Sen University Kaohsiung – Taiwan): “The Art and Science of Packaging High-Coupling Photonics Devices and Modules”:
- October 22, 2012 – Avago Tech. via Schiaparelli 12, Torino, ore 11
- October 23, 2012 – Univ. di Pavia Dip. di Elettronica, Aula seminari Piano D, ore 11:00
- October 23, 2012 – Politecnico di Milano, DEI, Via Golgi 40, aula ALFA, ore 14