34th Edition Technologies of Interconnections in Electronics
Universitatea Transilvania din Brasov B-dul Eroilor nr. 29, Brasov, RomaniaTechnologies of Interconnections in Electronics (TIE) is an international student professional contest focused on promoting and evaluating skills in the technological computer-aided design (CAE-CAD-CAM) of electronic modules and printed circuit boards (PCBs). Established in 1992, TIE aims to bridge the gap between academia and industry by certifying students' knowledge and abilities in 6 topics related to electronic packaging.
2025 IEEE 48th International Spring Seminar on Electronics Technology
H-1097, Könyves Kálmán krt. 34, Budapest, Hungary H-1097, Könyves Kálmán krt. 34, Budapest, HungaryThe International Spring Seminar on Electronics Technology (ISSE) is the premier European forum for exchanging information between senior and young scientists from academic communities and electronic industries around the world.
2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME)
Aula Sergiu Chiriacescu, Brasov Aula Sergiu Chiriacescu, Iuliu Maniu Street 41A, Brașov 500091, Brasov, RomaniaIn agreement with IEEE and IEEE Hungary & Romania EPS&NTC Joint Chapter, APTE is organising SIITME 2025 as a in-person, traditional conference on the 22th – 25th October 2025 in Brasov, Romania.