Chapter Officers’ Monthly Meeting – January
Budapest, Pest Megye, Hungary, Virtual: https://events.vtools.ieee.org/m/299411Monthly Chapter Officers' Meeting of the Hungary&Romania EPS&NTC Chapter - January Budapest, Pest Megye, Hungary, Virtual: https://events.vtools.ieee.org/m/299411
INDUSTRY PANEL AND SOCIAL MIXER FOR IEEE NTC YPs
Hodzovo Namestie 2, Bratislava, Slovakia, Slovakia, 81625A round table with three industrial companies, followed by moderated Q&A, will be held on Monday 11th Sept. afternoon. The selected panelists will be i) Lukáš Hatala (lukas.hatala@dxc.com) - Bizzcom, s.r.o., ii) Ondrej Kubovič (ondrej.kubovic@eset.com) - ESET, s.r.o. iii) Dr. Maksym Plakhotnyuk (mp@atlant3d.com) - ATLANT 3D Nanosystems. Following this round table activity, an “IEEE Young Professionals social & networking event" will be held the next day, at the end of the conference activities (after 7:00 PM). The event will be held at the "Fabrika the Beer" Pub, LOFT Hotel (https://www.lofthotel.sk/en/fabrika-the-beer-pub). At this core event, the YPs and student attendees, both IEEE members and non-members, are invited to a get-together to mingle with their colleagues from different parts of the world. The event will be an informal social gathering situation for YPs. The reception is a place to celebrate YPs, that are the future of NTC community. Co-sponsored by: IEEE NANOTECHNOLOGY COUNCIL, IEEE MAGNETICS SOCIETY Hodzovo Namestie 2, Bratislava, Slovakia, Slovakia, 81625
ISSE 2024
Videnska 1083, 142 20 Prague 4, Czech Republic Videnska 1083, Prague, Prague, Czech RepublicThe International Spring Seminar on Electronics Technology (ISSE) is the premier European forum for exchanging information between senior and young scientists from academic communities and electronic industries around the world. Topics include experimental and theoretical work in a widespread field of electronics and micro/nanoelectronics technology, electronics manufacturing, electronics packaging, advanced research, and teaching. Based on a combination of oral and poster presentations as well as individual meetings, professors, industrial participants, students, senior and junior researchers come together in a unique forum to discuss scientific and educational topics and organize international cooperation in a convenient atmosphere during the conference days. ISSE 2024 will continue the long tradition of the preceding ISSE conferences, starting in 1977 (Weissig/Germany) and the last one held in Timişoara (Romania, 2023). We are pleased to encourage you to participate in ISSE 2024.
YOUNG PROFESSIONALS NETWORKING EVENT
Congress Centre (Palacio de Congresos), Feria de Muestras FIDMA, Paseo Dr. Fleming, 481, Gijon, Asturias, Asturias, Spain, 33201Embark on a journey of shared experiences and professional growth at IEEE NANO 2024’s “Young Professionals” special event! Tailored for students and emerging talents in the dynamic fields of nanotechnology and nanoscience, this gathering provides a unique platform for networking and knowledge exchange in a relaxed and congenial atmosphere. Engage with your peers facing similar challenges, share stories of triumphs and lessons learned, and forge connections that will extend beyond the event. The “Young Professionals” event is a chance for you to contribute your perspectives and aspirations to the collective discourse of the nanotechnology community. Come join us at the Congress Centre (Palacio de Congresos), Feria de Muestras FIDMA Paseo Dr. Fleming, 481 in Gijón (Asturias) for an evening of camaraderie, insights, and the chance to build lasting connections that will propel your career in nanotechnology forward. Your journey begins at “Young Professionals” – where the future of nanoscience. [] Congress Centre (Palacio de Congresos), Feria de Muestras FIDMA, Paseo Dr. Fleming, 481, Gijon, Asturias, Asturias, Spain, 33201
10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024)
The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. This year’s conference takes place in Berlin from September 11-13, 2024.
2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Lucian Blaga University of Sibiu Library Lucian Blaga Street 2A, Sibiu, RomaniaIn agreement with IEEE and IEEE Hungary & Romania EPS&NTC Joint Chapter, APTE is organising SIITME 2024 as a in-person, traditional conference on the 16th – 19th October 2024 in Sibiu, Romania.
34th Edition Technologies of Interconnections in Electronics
Universitatea Transilvania din Brasov B-dul Eroilor nr. 29, Brasov, RomaniaTechnologies of Interconnections in Electronics (TIE) is an international student professional contest focused on promoting and evaluating skills in the technological computer-aided design (CAE-CAD-CAM) of electronic modules and printed circuit boards (PCBs). Established in 1992, TIE aims to bridge the gap between academia and industry by certifying students' knowledge and abilities in 6 topics related to electronic packaging.