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34th Edition Technologies of Interconnections in Electronics
34th Edition Technologies of Interconnections in Electronics
Technologies of Interconnections in Electronics (TIE) is an international student professional contest focused on promoting and evaluating skills in the technological computer-aided design (CAE-CAD-CAM) of electronic modules and printed circuit boards (PCBs). Established in 1992, TIE aims to bridge the gap between academia and industry by certifying students' knowledge and abilities in 6 topics related to electronic packaging.
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