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Hu&Ro EPS&NTC Chapter

Name: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Start: 2024-10-16T00:00:00+03:00
End: 2024-10-19T23:59:59+03:00
Location: Lucian Blaga University of Sibiu Library

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Aula Sergiu Chiriacescu, Brasov
Budapest, Pest Megye, Hungary, Virtual: https://events.vtools.ieee.org/m/299411
Congress Centre (Palacio de Congresos), Feria de Muestras FIDMA, Paseo Dr. Fleming, 481, Gijon, Asturias, Asturias, Spain, 33201
H-1097, Könyves Kálmán krt. 34, Budapest, Hungary
Hodzovo Namestie 2, Bratislava, Slovakia, Slovakia, 81625
Lucian Blaga University of Sibiu Library
Universitatea Transilvania din Brasov
Videnska 1083, 142 20 Prague 4, Czech Republic

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Association for Promoting Electronics Technology
Budapest University of Technology and Economics
Czech Technical University Prague

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September 2024

Wed 11

September 11, 2024 - September 13, 2024

10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024)

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. This year’s conference takes place in Berlin from September 11-13, 2024.

500EUR

October 2024

Wed 16

October 16, 2024 - October 19, 2024

2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Lucian Blaga University of Sibiu Library Lucian Blaga Street 2A, Sibiu, Romania

In agreement with IEEE and IEEE Hungary & Romania EPS&NTC Joint Chapter, APTE is organising SIITME 2024 as a in-person, traditional conference on the 16th – 19th October 2024 in Sibiu, Romania.

EUR200

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