Mission
The mission of the Joint HU-RO IEEE-EPS Chapter is to foster collaboration and knowledge exchange among electrical and electronics engineers, students and researchers active in the field of components, packaging and manufacturing technology.
The Chapter aims to provide a platform for disseminating information, sharing scientific results, and addressing mutual challenges through events such as seminars, international conferences, students professional contests and trainings. By connecting professionals from Hungary and Romania, the Chapter contributes to advancements in electronic modules design and technology.
Historical Overview of the Hu&Ro Joint IEEE-EPS Chapter
The Beginnings
The idea to form an IEEE Components, Packaging and Manufacturing Technology Society (CPMT) later transformed to IEEE Electronics Packaging Society (EPS) Chapter was raised by James (Jim) E Morris, then Vice President (VP) of Conferences of CPMT, to Zsolt Illyefalvi-Vitéz, in Austin during a working breakfast before the 23rd International Electronics Manufacturing Technology Symposium from 19-21 October 1998.
Zsolt, who held positions at the Budapest University of Technology and Economics (BME) and chaired the Steering Committee of the International Spring Seminar on Electronics Technology (ISSE), was actively involved in conferences organized by CPMT and the International Microelectronics and Packaging Society (IMAPS). Jim, already familiar with Zsolt’s work, proposed the concept of creating a Chapter.
Zsolt embraced the idea and took on the task of forming the Chapter. He explained ISSE’s mission to Jim and invited him to the next seminar in Dresden. However, there was a challenge: the Chapter needed at least 12 CPMT members. While some colleagues from other countries were part of existing Chapters, Zsolt found support among CPMT members in the Romania Section. Under the enthusiastic leadership of Paul Svasta, a professor at the University Politehnica of Bucharest (UPB) and Director of the Center for Electronics Technology and Interconnection Techniques (CETTI), the Joint Section Chapter was established.
From 1999 to 2008, the Chapter integrated into IEEE CPMT activities. During ISSE’99 in Freital-Dresden, there was an opportunity to meet in person with most of the Hu & Ro Sections CPMT members. In connection with the seminar, we organized an informal section meeting and an official Nomination Committee meeting. Our focus shifted to organizing the SIITME symposia alongside the ISSE seminars, and we worked on formulating a chapter mission statement.
The SIITME (International Symposium for Design and Technology in Electronic Modules) is an annual seminar series that held its 5th conference in Bucharest from September 18 to 20, 1999. The primary objective of SIITME is to provide an international platform for sharing information and scientific results related to research and development activities in both universities and industry. Similar to ISSE, SIITME allows electrical and electronics engineers and scientists working in components, packaging, and manufacturing technology to connect and discuss mutual challenges. IEEE consistently sponsored the SIITME symposiums. We officially kicked off the Chapter during SIITME’99.