Cosmin Moisa – Industrial Coordinator

Biography

Cosmin Moisa is the Head of Microelectronics Integration at the Technology Organisation Timisoara, part of Continental Automotive România.

Cosmin studied Electrical Engineering at the Politehnica University of Timisoara from 1999 to 2006, including a 6-month diploma stage at the “Fraunhofer Institute for Manufacturing Engineering and Automation” IPA in Stuttgart, Germany. He began his career in 2005 as a Hardware Engineer at Siemens VDO, Timisoara.

Since 2010, Cosmin has been actively involved in the Interconnection Techniques in Electronics (TIE) contest as General Industrial Co-Chair and the IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) as Conference Co-Chair. In 2011, he became the Head of Department for Hardware and System Engineering. From 2012 to 2019, he served as an Associated Lecturer and coordinator for the external class Development of Electronic Products.

Between 2015 and 2022, Cosmin led the Product Development Center for Camera and Interior Sensing in Timisoara. In 2020, he co-organized and hosted the kick-off for the IEEE Hungary & Romania EPS & NTC Joint Chapter. He began his role as IEEE Romania Section Industry Ambassador in 2021 and was nominated as the Secretary of the Working Group Microelectronics under the Aegis of the Romanian Academy the same year.

IEEE Positions

IEEE Romania Section
Industry Ambassador: 2021-

IEEE-SIITME (International Symposium for Design and Technology in Electronics Packaging)
Steering Committee member: 2018-

IEEE Hungary&Romania EPS&NTC Joint Chapter
Industrial Coordinator: 2023-